Precision SMT Solutions for Modern Electronics

Advanced surface mount technology with world-class precision, automation, and quality assurance for next-generation electronics manufacturing.

Versatile Assembly Capabilities

  • Supports both high-speed mass production and low-volume, complex builds with exceptional flexibility
  • Suitable for a wide range of PCB assembly needs across multiple industries

Advanced Quality Inspection

  • Automated Optical Inspection (AOI) for comprehensive quality control
  • Solder Paste Inspection (SPI) ensuring optimal paste application
  • Real-time X-ray systems for internal component verification
  • Ensures accuracy for Ultra-fine pitch components, BGA (Ball Grid Array), and Micro-components

Trusted Across Industries

  • Consumer Electronics - smartphones, tablets, wearables
  • Automotive - ECUs, sensors, infotainment systems
  • Medical Devices - diagnostic equipment, monitoring systems
  • Industrial Equipment - automation, control systems
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Key Features & Capabilities

High Precision Support

  • Capable of placing components as small as 01005 inch (0402 mm)
  • Delivers exceptional placement accuracy and stability

Double-Sided Reflow

  • Enables efficient and precise assembly on both sides of the PCB
  • Advanced thermal profiling for optimal solder joints

Optimized Environment

  • Automated material handling systems
  • ESD-compliant processes throughout
  • Optional cleanroom conditions for contamination-free production

Quality Assurance

  • Full traceability system for end-to-end process monitoring
  • Maintains high product quality and boosts customer confidence
  • Real-time defect detection and correction
Sandwich Layer Process

Advanced SMT Capabilities for Complex PCB Stack Assemblies

Our SMT lines are capable of assembling complex, multi-layer stacked boards such as:

High-Density Interconnect (HDI) PCBs

Microvias and fine-pitch components for space-constrained applications

Rigid-Flex PCBs

Multi-Chip Modules (MCM)

Advanced packaging with multiple integrated circuits in a single package

Package-on-Package (PoP) Assemblies

Stacked IC packages for high-density memory and processing

Precision, Automatic, Flexible

Our cutting-edge SMT production lines, capable of delivering high-volume, high-mix electronics manufacturing with world-class precision, cleanliness, and automation a perfect fit for advanced electronics in sectors like mobile, industrial, and automotive.

Precision, Automatic, Flexible

SMT Process

SMT Process

Looking for reliable SMT assembly?

Bring your electronic ideas to life with high-quality PCB services.