Versatile Production Capabilities
- Optimized for both high-speed mass production and high-mix, low-volume complex assemblies.
- Seamless integration of SMT and Auto-Insertion (AI) for diverse component mounting requirements.
High-Precision SMT Solutions for Next-Gen Electronics
We deliver world-class accuracy and automation, ensuring superior reliability for complex electronic systems across automotive, medical, and mobile sectors.
Advanced Multi-Stage Quality Inspection
- Solder Paste Inspection (SPI) for 3D paste volume accuracy
- Automated Optical Inspection (AOI) for comprehensive component placement verification
- Real-time X-Ray Inspection for BGA and hidden solder joint verification
- Precision In-Circuit (ICT) and Functional Testing (FCT) for 100% reliability
Proven Expertise Across Sectors
- Consumer Mobility - High-density smartphone and wearable assemblies
- Automotive Intelligence - ADAS, infotainment, and ECU controllers
- Medical Technology - Life-supporting diagnostic and monitoring systems
- Industrial Automation - High-reliability control systems and IoT gateways
Elite Technical Capabilities
Ultra-Fine Precision
- Support for micro-components down to 008004 inch (0201 mm) size
- Exceptional placement accuracy for dense PCB layouts
Thermal Management
- Double-sided reflow with multi-zone nitrogen-capable ovens
- Advanced thermal profiling for complex thermal mass boards
Infrastructure
- Strict ESD-controlled environment and material handling
- Automated 'Smart Rack' systems for error-free component loading
- Class 10k/100k Cleanroom capabilities for critical assemblies
Smart Traceability
- Full MES-SAP integration for real-time traceability and monitoring
- Production yield analysis and proactive quality management
- Individual board-level tracking across all process stages
Specialized Assembly for Complex PCB Architectures
Our SMT infrastructure is specifically designed for high-density, multi-layer, and high-complexity board architectures:
HDI (High-Density Interconnect) PCBs
Expertise in microvia technology and fine-pitch component mounting
Rigid-Flex & Flexible Circuits
Precision handling and assembly of flexible materials for 3D electronics
MCM (Multi-Chip Module)
High-accuracy mounting of multiple die or ICs within integrated packages
PoP (Package-on-Package)
Vertical stacking of logic and memory packages for maximized density
Scalable, Automated & Intelligent
Our SMT lines represent the pinnacle of automated manufacturing, combining the speed of modern equipment with the intelligence of integrated MES systems — ideal for the world's most demanding electronic products.
Quality Systems
