PT Sat Nusapersada Tbk | Surface Mount Technology

SMT DEPARTMENT

Capable of mounting from small 0402 (01005) chip.
Odd shape component 100x26mm.
Micro BGA with 0.12 ball size on multi layer FPC.
Placing accuracy up to 30 micron.
Flip chip (C4 Process).
Package to package mounting process.
More than 20 years of manufacturing & assembling experience.
Handles 0201 resistors, ball grid arrays (BGA), fine pitch devices up to 70mm2.
24/7 production lines capable of handling high volume low complexity to low volume high complexity orders.
Fast track prototyping to volume assembly.
Quick change intelligent feeders.
Fully automated in-line optical inspection.
Lead-Free Surface Mount Technology.
Capacity to populate usual PCB materials, plus-flexi, flexi rigid, aluminum & microwave substrates.
Flexible production lines (ESD Class 2A & 3A Certified).
N2 reflow process capability.

Our PCB Mounting Capabilities Include Both
SURFACE MOUNT TECHNOLOGY AND AUTO INSERT MACHINE PT SAT NUSAPERSADA Tbk