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  • Some of our clients:
SMT DEPARTMENT
  • Capable of mounting from small 0402 (01005) chip.
  • Odd shape component 100x26mm.
  • Micro BGA with 0.12 ball size on multi layer FPC.
  • Placing accuracy up to 30 micron.
  • Flip chip (C4 Process).
  • Package to package mounting process.
  • More than 20 years of manufacturing & assembling experience.
  • Handles 0201 resistors, ball grid arrays (BGA), fine pitch devices up to 70mm2.
  • 24/7 production lines capable of handling high volume low complexity to low volume high complexity orders.
  • Fast track prototyping to volume assembly.
  • Quick change intelligent feeders.
  • Fully automated in-line optical inspection.
  • Lead-Free Surface Mount Technology.
  • Capacity to populate usual PCB materials, plus-flexi, flexi rigid, aluminum & microwave substrates.
  • Flexible production lines (ESD Class 2A & 3A Certified).
  • N2 reflow process capability.


Our PCB Mounting Capabilities Include Both
SURFACE MOUNT TECHNOLOGY AND AUTO INSERT MACHINE PT SAT NUSAPERSADA Tbk